The new GE865 introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enables the design of very compact applications. Since connectors are eliminated, the solution cost is significantly reduced compared to conventional mounting.
With its ultra-compact design and extended temperature range, the Telit GE865 product line is the perfect platform for high-volume M2M applications and mobile data devices. Additional features such as integrated TCP/IP protocol stack and serial multiplexer extend functionality of the application at no additional cost.
State-of-the-art ADCs, DACs and GPIOs provide connectivity to external peripherals such as sensors and displays.
This smaller SMD module requires an external SIM card socket and external Antenna Connection (50Ohm). This module interfaces through 3V CMOS logic levels. You must not use 5V levels. We recommend a simple voltage divider or equivalent logic level translation circuit.
Dimensions: 22x22mm (3.0mm thickness)